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VS6650
1.0 Megapixel SMIA Camera Module
DATA BRIEF
FEATURES 1.0 Megapixel resolution (1152H x 864V)

SMIA1 1.0 profile 1 compliant imager CCP 2.0 serial video interface Two-wire control port (CCI) On-chip PLL based on 13 MHz system clock Up to 30 frame per second (fps) progressive scan, with smooth frame rate control Horizontal downscale from 1x to 4.5x in 1/16 steps Operation from 2.4 V analog power supply Low EMI 1.8 V digital and I/O power supply 30 W power-down consumption 10-bit on-chip ADC Small size 1/3 inch lens fixed focus module Integral EMC shielding The VS6650 features allow straightforward integration into mobile phone designs: low EMI video interface and package/socket shielding, low wire count (8 total), embedded power management (30 W power-down) and embedded PLL. A minimal list of external components is required: supply decoupling capacitors, CCI pull-ups and a chargepump capacitor. The VS6650 3-element lens design ensures high quality image capture while maintaining low module height. The overall optical stack, including lens system, IR filter and sensor optical structures is developed within ST. The VS6650 package uses the second generation of SmOP2 packaging technology. Sensor and lens are assembled in a fully automated test and focus process for high volume and low cost production. This 1.0 Megapixel sensor fits within the SMIA95 form factor (9.5 x 9.5 x 7.6 mm3). APPLICATIONS Mobile phone

DESCRIPTION The VS6650 is a 1.0 Megapixel camera module for use across a range of mobile phone platforms. The camera module, which is SMIA 1.0 profile 1 compliant, can generate 1.0 Megapixel images up to 30 fps. Based on the SMIA architectural concepts, the VS6650 can be used with or without image processor (i.e. STV0976 or STV0984). The module is suitable for performance-driven camera phones and cost-driven high volume designs. The embedded horizontal scaler typically enables the realization of power-efficient viewfinder that uses host software processing. For performance driven applications or when a different video interface is required, the STV0976 mobile imaging processor ensures state-of-the-art image reconstruction and compression at up to 15 fps.
PDA Wireless security camera
Table 1. Order Codes
1.Standard Mobile Imaging Architecture, visit www.smia-forum.org
Part Number VS6650S02F/T2
Description SmOP2 SMIA95 22" tape and reel
Rev. 1 October 2004 1/3
VS6650
Figure 1. Application Diagram
EXTCLK STV0976 XSHUTDOWN 1.0 Megapixel SMIA Mobile CCI Imaging Processor (optional) CCP 2.0 Baseband or Application Processor
Table 2. Technical Specifications
Active pixels 1152H x 864V 4.0 m x 4.0 m 4.640 mm x 3.488 mm RGB Bayer +120 dB +24 dB (max) 61 dB (typical) 35 dB at 100 lux 5 to 30 Hz (1152H x 864V) Raw Bayer 10-bit Raw Bayer 8-bit compressed CCP 2.0 high-speed serial 390 Mbit/s D/S encoding 1.8 V LVDS 6 to 27 MHz square 13 MHz typ. (on-chip PLL) 2.4 to 2.9 V analog 1.8 V 0.1 V digital 1.8 V CMOS levels Streaming @ 15 fps: 85 mW max. Power down: 15W max. 3-element 50 HFOV f#3.2 50 cm to infinite <1% 45 % (typical) SmOP2 SMIA 95 9.5 x 9.5 x 7.6 mm3 (wlh) 16-pin SMD socket with EMC shield Pixel size Array size Color filter array Exposure control Analog gain Dynamic range
VS6650
1.0 Megapixel SMIA Camera Module
Figure 2. Block Diagram
Signal-to-noise Ratio Frame rate
VS6650
EXTCLK XSHUTDOWN PLL and Clock Management Power Mgmt Power-On Reset CCI Receiver Sensor Control Registers 1160 x 872 Pixel array 1152 x 864 VDIG DGND VCAP VANA AGND
Pixel format
Video Interface
SCL SDA CLKP CLKN DATAP DATAN
Y Decoder
CCP 2.0 Transmitter
Readout
SMIA Profile 1 Frame Formatter
Clock input
Column ADC X Decoder Line SRAM
Supply voltage I/O voltage Power consumption Lens Depth of field TV distortion Relative illumination Package type Package size System attach
Figure 3. Outline Drawing
Table 3. Temprature Range
Storage Functional Normal operating Optimal operating Test -40 to +85C -30 to +70C -25 to +55 C +5 to +30C 23 2C
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VS6650
REVISION HISTORY
Table 4. Revision History
Date October 2004 Revision 1 First Issue Description of Changes
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners (c) 2004 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com
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